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. 2021 Sep 29;7(40):eabi7410. doi: 10.1126/sciadv.abi7410

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Copyright © 2021 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).

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Fig. 3. — (A) In-plane thermal conductivities versus shearing speed for SUPE films. (B) Tensile stress versus strain curves of shearing SUPE samples. (C) Resistivity change versus current density of printed copper features on flexible Kapton and SUPE film substrates. (D) Temperature dependence of the scattering parameter S11 for printed copper-SUPE antenna device within frequency ranging from 0 to 4.8 GHz. The inset is the antenna setup for printed copper features on SUPE substrate. Finite element simulations of the steady-state temperature distribution in (E) Kapton and (F) SUPE films. Photo credit: Zheng Li, University at Buffalo.