. Author manuscript; available in PMC: 2022 Jun 1.

Published in final edited form as: Adv Mater Technol. 2021 May 3;6(6):2100149. doi: 10.1002/admt.202100149

Table 1.

Deposited metal stacks used for XPS depth profiling. Stacks were encapsulated between two 250 nm a-SiC:H layers on 5 μm polyimide and annealed at 450 °C.

Metal stack identifier	Bottom adhesion	Metal core	Top adhesion
Stack A	50 nm Ti	300 nm Pt	50 nm Ti
Stack B	50 nm Ti	300 nm Au	50 nm Ti
Stack C	50 nm Ti	100 nm Pt + 100 nm Au + 100 nm Pt	50 nm Ti
Stack D	50 nm Ti	100 nm Pt + 100 nm Au + 100 nm Pt	None