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. Author manuscript; available in PMC: 2022 Jun 17.
Published in final edited form as: J Neural Eng. 2021 Jun 17;18(4):10.1088/1741-2552/ac02dc. doi: 10.1088/1741-2552/ac02dc

Figure 3.

Figure 3.

3D illustration of the ultra-low profile, high-density (0.8 mm pitch) spring connector. The LCP-TF electrode array design included four alignment holes and a stiffener to increase the thickness and rigidity of the device in the connector area. The alignment holes and stiffener were standard features of the LCP flexible circuit process. (Inset) A side view of the spring connector highlighting the metal springs on the top and bottom of the connector.