Figure 3.
3D illustration of the ultra-low profile, high-density (0.8 mm pitch) spring connector. The LCP-TF electrode array design included four alignment holes and a stiffener to increase the thickness and rigidity of the device in the connector area. The alignment holes and stiffener were standard features of the LCP flexible circuit process. (Inset) A side view of the spring connector highlighting the metal springs on the top and bottom of the connector.