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. 2021 Oct 13;7(42):eabj0694. doi: 10.1126/sciadv.abj0694

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Fig. 2. — (A) Design of 3DE circuit pattern on 3D mold. (B) Thermoforming simulation. (C) Predistorted pattern generation. (D) Patterning the EGaIn-CP electrode and mounting electronic devices on 2D planar SEBS film based on the predistorted pattern. (E) Thermoforming process. (F) Fabricated 3DE.