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. 2021 Oct 19;12:6080. doi: 10.1038/s41467-021-26353-1

Fig. 2. Scheme of the fabrication process and images of the printed NEMS devices.

Fig. 2

a Scheme of the fabrication process starting from the precursor solution preparation, followed by TPP printing to photopolymerize locally the solution, structure washing, and final heating step to remove organic content and achieve densification and crystallization. b CAD scheme and c SEM image of a chip composed of six cantilevers of two different widths. d Images of the bridge, cantilever, and membrane devices before and after the heating step at 1500 °C. All the scale bars correspond to 10 µm.