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. 2021 Oct 29;7(44):eabi9884. doi: 10.1126/sciadv.abi9884

Table 2. Functional monomers used for epitope MI and corresponding intermolecular interactions.

Functional monomer Molecular interaction(s) Reference(s)
Acrylic acid H-bonding; electrostatic (−) (42, 73, 77, 167169)
Methacrylic acid H-bonding (67, 74, 76, 90, 93, 105, 106, 111, 140, 190, 224)
Methyl methacrylate H-bonding; hydrophobic (161, 223)
2-(Trifluoromethyl) acrylic acid Electrostatic (−) (90, 94, 96, 117, 140, 198)
2-(Hydroxyethyl) methacrylate Hydrophilic; H-bonding (90, 140, 142, 224)
2-(Aminoethyl) methacrylate H-bonding; electrostatic (+)
Benzyl methacrylate Hydrophobic; π-π stacking; aromatic rings may aid
charge transfer
(109, 112)
3-Sulfopropyl methacrylate potassium Electrostatic (−); sulfur may aid grafting on gold
surface
(109, 112)
Dimethylaminoethyl methacrylate Electrostatic (+) (90, 96, 140)
Acrylamide H-bonding (48, 67, 71, 92, 94, 95, 160, 171, 190, 199, 224)
Methacrylamide Hydrophilic; H-bonding (86, 90, 106, 157)
2-(Hydroxyethyl) acrylamide Hydrophilic; H-bonding (69)
Phenylacrylamide H-bonding; hydrophobic; π-π stacking (117)
N-tert-butylacrylamide Hydrophobic (73, 77, 90, 93, 96, 117, 167169, 190, 198, 199, 224)
N-[3-(dimethylamino)propyl]methacrylamide Electrostatic (+) (42)
N-(3-aminopropyl)methacrylamide Electrostatic (+) (73, 77, 167, 169)
N-(2-aminoethyl)methacrylamide Electrostatic (+) (90, 140, 141, 225)
N-isopropylacrylamide Hydrophilic; H-bonding (42, 73, 76, 77, 81, 88, 96, 117, 156, 159, 160, 167169,
198, 199)
4-Acrylamidophenyl(amino)-methaniminium
chloride or acetate
Electrostatic (+) (69, 157, 159)
N-acrylamido-benzamidine Electrostatic (+) (86)
N-methacryloyl-l-aspartic acid Electrostatic (−) (142)
Zinc acrylate Metal chelation; heterocyclic compound
formation
(81, 82, 97, 102, 154, 170, 171)
Vinylphosphonic acid-Ti4+ Metal coordination (156)
Ti4+-ethylene glycol methacrylate phosphate Metal coordination; hydrophilic (153)
Vinylphenylboronic acid Hydrophobic; π-π stacking; boronate affinity for
cis-diols
(85, 160, 161, 170)
4-Formylphenylboronic acid π-π stacking; boronate affinity for cis-diols (84)
3-Aminobenzeneboronic acid Electrostatic (+); π-π stacking; boronate affinity for
cis-diols
(83)
3-Ureidopropyltriethoxysilane H-bonding; electrostatic (+) (70, 155, 172)
3-Aminopropyltriethoxysilane Electrostatic (+) (75, 100, 172, 222)
3-Isobutyltriethoxysilane Hydrophobic (172)
1-Propyltrimethoxysilane-3-methylimidazolium
chloride
Electrostatic (+) (100)
4-Vinylpyridine Electrostatic (+) (90, 105, 140)
2-(-3-(4-Nitrobenzo[c][1,2,5] oxadiazo-7-yl)ureido)
ethylmethacrylate
H-bonding (fluorescence) (85)
N-3,5-bis (trifluoromethyl)-phenyl-N′-4-
vinylphenylurea
H-bonding (90, 140)