Fig. 3.
Device assembly and patterning. Sample process for device making. (a) Spin coating of black absorption filter. (b) Patterned removal of filter using Nd:YAG laser. (c) Connecting the device to the PCB (green) using wire-bonding machine. (d) Soldering of copper wires for connecting to the CPU. (e) Sample set-up with plastic-bottom culture dish (black) on top of image sensor encased in a light-tight box (silver; cover not shown) inside an incubator.
