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. 2021 Nov 28;14(23):7274. doi: 10.3390/ma14237274
FIB Focused ion beam
MO Magneto-optical
AFM Atomic force microscopy
EDS Energy Dispersive X-ray Spectrometry
SEM Scanning Electron Microscope
GF Grooved Film
PF Plain Film
S Plain region of Grooved Film
S′ Groove region of Grooved Film
Tc Superconducting critical temperature
WL Weak-link
TcWL Weak-link critical temperature
Hrem Remnant DC magnetic field
h Applied excitation field amplitude
T Temperature
ρ(T) Temperature-dependent resistivity
n Power-law exponent in ρ(T)
AS (AS) Cross-section area of the grain (groove)
IS (IS) Length of the grain (groove)
ρ0 Residual resistivity
ρS Groove resistivity
ρG Grain resistivity
ρepi Electron-phonon-impurity resistivity contribution
ρsd sd interband scattering resistivity contribution
ρss ss intraband scattering resistivity contribution
ρ10 Resistivity at 10 K
ρ300 Resistivity at 300 K
VG Voltage measured between electrodes 2 and 3 (plain region)
VSSS Voltage measured between electrodes 3 and 4 (SS′S contribution)
B Electron-phonon-impurity coefficient
ΘD Debye temperature
Tmax Upper limit of temperature to fit ρ(T)
χAC(T) Temperature-dependent AC susceptibility
χ Real part of χAC
χ Imaginary part of χAC
f Frequency
R Resistance
RRR Residual resistivity ratio
l Mean free path
ξ Coherence length
λ Penetration depth
Hc2 Upper critical field