Table 1.
Scaffold/material structure | Conductor incorporation method | Conducting material |
---|---|---|
Films (2D) | Chemical vapour deposition | Graphene (44–46, 61) |
Electrochemical polymerisation | OCPs (27, 35, 36, 62–64) | |
Vapour phase polymerisation | OCPs (53) | |
Spin coating | OCPs (54) | |
Chemical polymerisation | OCPs (65, 66) | |
Composite | OCPs (67–69) | |
Films (3D template) | Chemical vapour deposition | Graphene (44) |
Vapour phase polymerisation | OCPs (70) | |
Electrospun nanofibrous mats | Composite | OCPs (55, 56, 71–73) |
Graphene (47, 48) | ||
Vapour phase polymerisation | OCPs (74) | |
Chemical polymerisation | OCPs (75–78) | |
Micron scale fibres | Wet spinning – composite | OCPs (57) |
Graphene (49) | ||
Moulding | Graphene (50) | |
Aerogels | Composite | Graphene (79, 80) |
Vapour phase polymerisation | OCPs (81) | |
Chemical polymerisation | OCPs (58) | |
Hydrogel | Composite | Graphene (82, 83) |
OCPs (60) | ||
Electrochemical polymerisation | OCPs (84) | |
Chemical polymerisation | OCPs (85, 86) | |
3D Extrusion Printed Scaffolds | Composite ink | OCPs (60, 87) |
Graphene (51, 52) |