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. 2022 Jan 14;8:11. doi: 10.1038/s41378-021-00331-5

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Fig. 8 — a The silicon wafer is spin-coated with SU-8. b SU-8 is patterned by UV exposure. c The SU-8 structure is obtained after the development process. d PDMS is casted on the SU-8 master. e The PDMS layer is peeled off from the master. f The PDMS layer and the glass substrate are bonded by oxygen plasma treatment