Table 3.
Technology | Power Source | Forming Method | Resolution | Component Size | Speed | Characteristic |
---|---|---|---|---|---|---|
SLA | Laser | Photopolymerization | μm | 100 μm–100 mm | Slow | Precision molding |
TPP | Laser | Photopolymerization | nm–μm | 1 μm–1 mm | Slow | Ultra-high precision |
DLP | Laser | Photopolymerization | μm | 10 μm–100 mm | Medium | Rapid prototyping and high precision |
DIW | Thermal energy |
Extrusion | μm–mm | 1 mm–10 cm | Medium | Muti-material molding |
SL | Laser | Photopolymerization | μm | 10 μm–100 cm | Fast | Large-size molding |