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. 2022 Jan 10;22(2):516. doi: 10.3390/s22020516

Figure 1.

Figure 1

Left Canvas: the sketch shows the vertical cross-section of the Timepix detector. The p-type superficial implantation on the n-type semiconductor creates a local depletion zone corresponding to the single pixel. The pixel is then connected to the ASIC read-out chip through a solder bump. Right Canvas: Sketch of the TimePix detector. The dimensions are in mm.