Table 1.
A summary of modern analog and digital interface impedances and typical multilayer PCB track width ranges.
| Interface | Impedance, (Ω) | Configuration | Standard Design Parameters Used in Multilayer PCB Manufacturing | Manufacturable Track Width Range with a Given Impedance, (mm) | Typical SMD Package (0201 to 1206) Component Footprint Pad Width Range, (mm) |
|---|---|---|---|---|---|
| Radio frequency (RF) chains | 50 | Single-ended |
εr = [3 … 5]; hcore/prepreg = [50 … 300] μm; copper thickness [0.5 … 2] oz; minimal distance between differential tracks 0.075 mm; |
[0.075 … 0.71] | [0.35 … 2] |
| 75 | |||||
| 100 | Differential | ||||
| 150 | |||||
| PCIe [2] | [85 … 90] | ||||
| USB2.x, USB3.x, USB4.x [1] | 85 | ||||
| LVDS [3], Serial RapidIO [4], CPRI [5], HDMI and other proprietary high-speed digital standards [7] | 100 | ||||
| DDR [6] | [50 … 60] | Single-ended | |||
| [100 … 120] | Differential |