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. Author manuscript; available in PMC: 2022 Feb 28.
Published in final edited form as: Optica. 2021 Jul 7;8(7):995–1002. doi: 10.1364/OPTICA.426199

Fig. 3.

Fig. 3.

Sketch of penetration experiment arrangement through (a) 3 mm thick GaAs wafer and (d) 190 µm water layer. (b) 3D reconstruction of one cent US coin (Union Shield) through 3 mm GaAs wafer. (c) Tomographic imaging of stacked cellulose acetate sheets through 3 mm GaAs wafer. Imaging of one cent US coin (Union Shield) through 190 µm water layer (380 µm in double pass) at (e) 2850 cm‒1 and (f ) 2600 cm‒1.