Table 1.

The B constant, substrate, and fabrication process for flexible thermistors that have recently been reported.

Material	B (K)	Substrate	Fabrication Process	Ref.
NiO	4337	Polyimide	Inkjet printing of nanoparticles and drying	[52]
NiO	8162	PET	Monolithic laser-induced reductive sintering	[46]
Ti1−xAlxN	2525	Polyimide	RF magnetron reactive sputtering	[51]
Mn1.56Co0.96Ni0.48O4	4429	PET	Photocrystallization of nanoparticles	[48]
Bi4Ti3O12	6515	Polyimide	Nanoparticle paste deposition and drying	[63]
Cs2SnI6	4400	Polyester	Inkjet printing of solutions and drying	[64]
amorphous-InGaZnO	2929	Metal foil	RF magnetron reactive sputtering	[47]
Sm0.5Sr0.5Mn0.9Ni0.1O3	2820	Polyimide (t: 5 μm)	Photocrystallization of nanoparticles	[53]
La0.5Ba0.5MnO3	2626	Al foil	Photocrystallization of nanoparticles	[65]