Table 1.

Summary of mechanical and thermal properties of common polymeric substrates.

Material	Modulus [Pa]	Strain at break [%]	Tglassa) [°C]	Tmeltb) [°C]	Tdegc) [°C]	Fabrication Methods	Thickness Range [μm]	Refs
Polyesters
Polyethylene Terephthalate (PET)	3.3×109	80–115	78	255	-	Molten extrusion, cold rolling	>1	[138,139]
Polyethylene Naphthalate (PEN)	6.25×109	42	120	263	-	Molten extrusion, cold rolling	>1	[138,139]
Polyimides
Kapton 100 HN	2.5×109	72	360–410	-	>500	Film extrusion	12.5–125	[140]
PI 2611	8.5×109	100	360	-	620	Spin coating	3–9	[141]
Liquid Crystal Polymers
Velctra A950	7–10×109	5.7	110	280	380	Film extrusion	25–3000	[142–144]
Epoxies
SU-8	2–5×109	6.5	200	-	380	Spin coating, UV curing	0.2–300	[145–147]
Poly(para-xylylene)
Parylene C	3×109	25–200	80–100	290	>125	CVDd)	0.2–100	[148–151]
Elastomers
PDMS	5–100×106	10–1000	−150	-	400–650	Molding, spin coating, 3D printing	>1	[152–154]
Hydrogels
Polyethylene glycol-dopamine	1.8×107	300	-	-	-	Electrochemical gelation, molding	>1000	[126,155,156]
Polyacrylamide-alginate	1–3×107	2000	-	-	>225	Molding, 3D printing	1500–3000	[157,158]

^a)T_glass: glass transition temperature;

^b)T_melt: melting temperature;

^c)T_deg: degradation temperature;

^d)CVD: Chemical Vapor Deposition