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. 2022 Jan 17;9(8):2104623. doi: 10.1002/advs.202104623

Table 1.

Characteristics of diverse 3D printing methods for freeform electronics

Printing methods Advantages Disadvantages Materials Printing resolution Applications
Inkjet printing E‐jet
  • High resolution

  • Variety of materials

  • Nozzle clogging problem

  • Highly dependent on substrate conductivity

  • Low yielding rate

>50 nm[ 212 ]
  • Supercapacitor[ 100 ]

  • Thin‐film transistor[ 63 ]

  • Interconnect[ 150 ]

Aerosol jet
  • High resolution

  • Variety of materials

  • Complex patterns printable on nonplanar surfaces

  • Substantial amount of overspray

  • Supplying system required

  • Coffee‐ring effect

>85 nm[ 95 ]
  • Photodetector[ 106 ]

  • Thin‐film transistor[ 107 ]

  • Interconnect[ 149 ]

Direct writing
  • High resolution

  • Complex patterns printable

  • Fast printing speed

  • One step process

  • Highly dependent on the rheology between ink and substrate

  • Low scalability

  • Nozzle processing required

>630 nm[ 195 ]
Photocuring SLA
  • Easy set‐up conditions

  • Large scale printable

  • Volume shrinkage after printing

  • Slow printing speed

  • Photocurable resin

  • Ceramic resin

>0.6 µm[ 219 ]
  • Tissue scaffold[ 127 ]

DLP
  • High precision

  • Fast printing speed

  • Volume shrinkage after printing

  • Small scale printable only

  • High cost

  • Photocurable resin

  • Ceramic slurry

>50 µm[ 220 ]
  • Dental field[ 221 ]

  • Jewelry casting[ 222 ]

CLIP
  • Fast printing speed

  • High mechanical strength

  • Coarse resolution

  • High cost

  • Low viscosity photocurable resin

>100 µm[ 133 ]
  • Point‐of‐care service[ 133 ]

  • High strength‐to‐weight‐ratio[ 133 ]

TPP
  • High resolution

  • In‐vivo usable

  • Transparent materials printable only

  • Slow printing speed

  • Transparent photocurable resin

∼100 nm[ 223 ]
  • In‐vivo biomedical applications[ 138 , 224 ]