Figure 1.

(a) Enamel damage (ED) and ARI Grade 0; (b) BRP debonding; (c) adhesive residues after CAS/BRP debonding; (d) SC debonding; (e) terrace-shaped enamel disaggregation following GIC/SC debonding; (f) ED Grade 3 after CAS/SC debonding; (g) LODI debonding and subsequent (h) ARI Grade 1 after CAS/LODI debonding; (i) larger ED Grade 3, which exceeds the former bracket base area; (j) impulse debracketing; (k) ARI Grade 3; (l) smooth enamel surface following rotary postprocessing; (m) adhesive residues following ultrasonic treatment; (n) ultrasonic-induced enamel traces; and (o) enamel traces and adhesive residues following rotary postprocessing.