Table 2.
Lamella thickness (defined as “Pattern Offset”) (µm) | Front Width Overlap (µm) | Rear Width Overlap (µm) | Milling Current (nA) | Pattern Type | DCM Rescan Interval (s) | |
---|---|---|---|---|---|---|
Rough Milling | 1.0 | 1.5 | 1.0 | 1.0 | Rectangle | 120 |
Medium Milling | 0.8 | 0.65 | 0.5 | 0.5 | CCS | 90 |
Fine Milling | 0.6 | 0.35 | 0.1 | 0.3 | CCS | 60 |
Finer Milling | 0.4 | 0.05 | 0.05 | 0.3 | CCS | 30 |
Polishing 1 | 0.15 | N/A | N/A | 0.03 | CCS | 30 |
Polishing 2 | 0 | N/A | N/A | 0.01 | CCS | 10 |
Milling and thinning were done at 20°, and a depth correction of 100% and 0° overtilt at 30 kV while polishing steps were set to 160%.