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. 2022 Apr 7;13(4):581. doi: 10.3390/mi13040581

Figure 4.

Figure 4

(a) SEM image of the device used in the LDV test; (b) 2D cross-sectional view of the 2-port electrode design used as input for the FEM simulations; (c) FEM results for the local displacement perpendicular to the wafer surface.