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. 2021 Oct 27;11(55):34676–34687. doi: 10.1039/d1ra05252g

Fig. 12. Infrared imaging; (a) photograph of the device consisting of 5 × 5 arrays of individually addressable pixels with an area of 10 × 10 mm2. Y is for Gr@PDA/Cu; N is for copper sheet. (b) Schematic diagram of the test structure. The hot air temperature is 30 °C. (c) Infrared imaging of the device.

Fig. 12