Dispenser printed TEGs.

p-Type	n-Type	Max temp. (°C)	Substrate	Performance (μW m−1 K−2)	Ref.
Sb2Te3-epoxy resin composite	Bi2Te3-epoxy resin composite	250	Polymide subsrate	p-Type: 150	48
				n-Type: 130
Sb2Te3-epoxy composite	Bi2Te3-epoxy composite	350	Glass	p-Type: 840	53
				n-Type: 150
—	Mechanical alloyed Bi2Te3 (1% Se)	350	Flex-PCB	n-Type: 300	56
Bi0.5Sb1.5Te3 with 8 wt% extra Te-epoxy	Bi-epoxy composite	250	—	n-Type: 90	59
				p-Type: 5
—	Bi2Te2.7Se0.3	Selective laser melting	—	n-Type: 1500	58
p-Type Bi2Te3	n-Type Bi2Te3	100	PDMS thick film	—	34