Technological summary of the microfabrication development and manufacturing of glass micromachining and 3D printing-based approaches for planar (2D) MEAs.
| Glass micromachining | 3D printed | |
|---|---|---|
| Environment | Cleanroom | Makerspace/benchtop |
| Process steps | >10 | <10 |
| Resolution | <1 μm | ∼2 μma,b, ∼27 μmc |
| Total time | Upto 4 months | ∼4 days |
| Cost | $$$$ | $ |
| Fabrication equipment | Mask aligner, fumehood, spinner, hot plate, wirebonder, die attach, E-beam evaporator, mask maker/high res. printer, dicing saw, etc. | 3D printer, oven, UV-lamp, micromill, laser, spinner, benchtop sputterer or E-beam evaporator, current source |
| Backend equipment | Yes | None |
| Materials | Glass wafer, photoresist, photo mask, metal pellets/metal target, insulation, solvents, PCB, gold wire, etc. | 3D printing resin, isopropanol, stencil mask, conductive ink, electroplating materials, insulation |
a
Laser micromachining (QuickLaze 50ST2, Eolite Lasers, Portland, OR, USA).
b
Nanoscribe GmbH (Nanoscribe, Eggenstein-Leopoldshafen, Germany).
c
Asiga Digital Light Processing (DLP) 3D printer (MAX X27); (Asiga, Sydney, Australia).