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. 2022 Apr 1;29(Pt 3):749–754. doi: 10.1107/S1600577522001886

Table 1. Summary of the parameters used in fabricating the two analyzers tested in this work.

Energy (keV) 11.2150 8.9808
Analyzer crystal reflection Si(844) Ge(337)
Bragg angle (°) 85.77 87.14
Analyzer crystal intrinsic energy resolution (meV) 14.6 36.5
Incident energy resolution (meV) 15 35
Measured energy resolution (including the convolution of the intrinsic and geometrical contributions) (meV) 29.4 56.6
Pixel size (before etching) (mm × mm) 1.55 × 1.55 1.55 × 1.55
Analyzer illumination diameter opening (mm) 100 100
Bonding method between diced crystal and supporting wafer Anodic bonding Glue
Etching solution/etching time 10% HNO3 + 90% HF / 10 min 10% HNO3+ 90% HF / 10 min