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. 2019 Oct 30;9(60):35273–35279. doi: 10.1039/c9ra05931h

DSC curing data of the different samplesa.

Sample T i (°C) T p (°C) ΔH (J g−1)
Epoxy
SPI
Epoxy-PAM 161.37 171 12.48
Epoxy-SPI 175.07 185 10.74
Epoxy-SPI-PAM 164.18 173 16.21
a

T i: Onset curing temperature; Tp: peak curing temperature; ΔH: enthalpy value.