DSC curing data of the different samplesa.
| Sample | T i (°C) | T p (°C) | ΔH (J g−1) |
|---|---|---|---|
| Epoxy | — | — | — |
| SPI | — | — | — |
| Epoxy-PAM | 161.37 | 171 | 12.48 |
| Epoxy-SPI | 175.07 | 185 | 10.74 |
| Epoxy-SPI-PAM | 164.18 | 173 | 16.21 |
T i: Onset curing temperature; Tp: peak curing temperature; ΔH: enthalpy value.