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Deposition parameters.
| Target diameter (mm) | Subtrate holder rotating speed (rpm) | Distance from Sputtering target to substrate holder (cm) | Applied power to target (W) | Sputtering rate (A/s) | Sputtering time (s) | Ar gas flow (SCCM) | Deposition pressure (Torr) | |
|---|---|---|---|---|---|---|---|---|
| Cu | 50.8 | 12 | 11 | 50 | 0.85 | 1176 | 30 | 5 * 10–3 |
| SnS2 | 50.8 | 12 | 11 | 25 | 0.67 | 3720 | 30 | 5 * 10–3 |
