Table 3.
Coating (substrate) | Deposition technique | H [GPa] | E [GPa] | Adhesion from scratch Test [N]a | Reference |
---|---|---|---|---|---|
DLC (CoCr) | Unbalanced MS | 13 | 100 | Guo et al., 2015 [129] | |
DLC (CoCr) | PECVD | 24 | Thorwarth et al., 2010 [130] | ||
DLC (cemented carbide) | Enhanced cathodic arc MS | 16.7 | 166 | Wang et al., 2015 [131] | |
F-FLC (Si) | PECVD | 16.41 | 132.65 | Wang et al., 2020 [132] | |
SiNx (CoCr) | HiPIMS | 12–26 | 173–293 | Skjöldebrand et al., 2017 [47] | |
SiNx and SiNxCy (CoCr and Si) | HiPIMS | 18 | 200 | Pettersson et al., 2013 [49] | |
SiNx (CoCr and Si) | RF MS | 18–24 | 0–7 | Olofsson et al., 2012 [53] | |
SiNO and F:SiCN (CoCr) | Unbalanced MS | 15 | 236 | Shi et al., 2012 [50] | |
SiNx (CoCr) | HiPIMS | 14–88 | Filho et al., 2019 [52] | ||
SiNx, SiCN, SiCrN and SiNbN (CoCr) | HiPIMS | 13–25 | 148–286 | Filho et al., 2019 [51] | |
SiNx (CoCr) | HiPIMS | Filho et al., 2020 [46] | |||
TiCN (Ti6Al4V) | Cathodic arc deposition | 8–10 | Sáenz de Viteri et al., 2015 [41] | ||
TiN (CoCr) | MS | 21–23 | 45–70 | Gallegos-Cantú et al., 2015 [42] | |
Multilayered TiN/CrN (CoCr) | MS | 8.0–13.5 | 50–70 | Gallegos-Cantú et al., 2015 [42] | |
TiN (cemented carbide) | Enhanced cathodic arc MS | 23.6 | 397 | Wang et al., 2015 [131] | |
TiAlN (cemented carbide) | Enhanced cathodic arc MS | 27.3 | 466 | Wang et al., 2015 [131] | |
Multilayered TiAlN (Ti6Al4V) | Closed field unbalanced magnetron sputter ion plating | 18.8–44.1 | 302.6–516.5 | 17-7-47.7 | Yi et al., 2016 [54] |
TiN (Ti or Ti6Al4V) | Laser nitriding | 997-1099 HV | Chan et al., 2017 [43] | ||
Nitrated TNZT | Laser nitriding | 14 | 171 (Er) | Chan et al., 2016 [133] | |
TiC (steel) | PECVD | 829-1500 HV | 40–70 | Vitu et al., 2008 [134] | |
CrN/NbN (CoCr) | HiPIMS | 34 | 447 | 50–100 | Hovsepian et al., 2016 |
CrN (cemented carbide) | Enhanced cathodic arc MS | 17.9 | 422 | Wang et al., 2015 [131] | |
CrN (CoCr) | Plasma nitriding | 12–19 | Liu et al., 2013 [135] | ||
CrCN (CoCr) | Plasma carbonitriding | 16–18 | Liu et al., 2013 [135] | ||
CrN and Cr2N (CoCr) | Plasma nitriding | 660-900 HV | Wang et al., 2010 [136] | ||
CrN/NbN (Stainless steel 304) | MS | 28 | 390 | 0.02 | Huang et al., 2017 [45] |
CrAlTiN (Stainless steel 304) | MS | 33 | 450 | 30.4 | Huang et al., 2017 [45] |
Multilayer TaC and Ta2C (CoCr) | Thermal treatment in molten salts |
24–37 | 250–316 | LC3: 11-48 | Balagna et al., 2012 [36] |
TaN(CoCr) | RF sputtering | 15–28 | 255–319 | Corona-Gomez 2021 |
LC2 according to ISO 20502 unless otherwise indicated.