Table 1.
Methods | Advantages | Disadvantages | Materials | Thermal conductivity (W m−1 K−1) | Filler loading | References |
---|---|---|---|---|---|---|
Solution mixing | Simple preparation process | Organic solvents are needed | GNP/PVA | 13.4 | 10 wt% | [92] |
Low processing temperature | Aggregation of graphene sheets | GO/SR | 0.34 | 0.1 wt% | [108] | |
Easy incorporation of functional components | GNP/PVB | 4.521 | 30 wt% | [109] | ||
Graphene/PE | 1.84 | 10 wt% | [110] | |||
Graphene/PP | 1.53 | 10 wt% | [110] | |||
Graphene/PVA | 1.43 | 10 wt% | [110] | |||
Graphene/PVDF | 1.47 | 10 wt% | [110] | |||
Graphene/BE | 0.542 | 1.45 vol% | [111] | |||
GO-PDA/PS | 4.56 | 0.96 vol% | [112] | |||
Melt mixing | High productivity | High processing temperature | GNP/PC | 1.13 | 20 wt% | [97] |
Simple preparation process | Decomposition of functional components | |||||
Restricted to thermoplastic materials | RGO/PA | 5.1 | 5 wt% | [113] | ||
Aggregation of graphene sheets | GNP/PC | 7.3 | 20 wt% | [50] | ||
In-situ polymerization | Lower contact thermal resistance between graphene and polymer | Complex preparation process | Graphene/PA6 | 0.416 | 10 wt% | [14] |
Limited productivity | Graphene-MLG /Epoxy | 5.1 | 10 vol% | [63] | ||
Graphene-GO/PA6 | 2.14 | 10 wt% | [90] | |||
f-G/PDMS | 0.761 | 2 wt% | [114] | |||
GNPs/Epoxy | 1.5 | 2.8 vol% | [51] | |||
GNP/PCBT | 2.49 | 30 wt% | [88] | |||
Pre-constructing 3D networks | Capability in fabricating highly conductive composites with ultralow filler content | Complex preparation process | GHF/Epoxy | 35.5 | 19.0 vol% | [41] |
Uniform filler dispersion | Relatively high processing costs | DAGF/Epoxy | 62.4 | 13.3 vol% | [115] | |
Efficient control of distribution/alignment of fillers | GA/Epoxy | 20 | 2.30 vol% | [70] | ||
Composites with novel performances can be fabricated | GNPs/GF/NR | 10.64 | 5.78 vol% | [75] | ||
VAIGN/Epoxy | 2.13 | 0.92 vol% | [60] | |||
GWFs/PI | 3.73 | 12 wt% | [116] | |||
MGF/GF/PDMS | 1.08 | 2.7 vol% | [28] | |||
GF/mGNPs/PVDF | 6.32 | 9.07 vol% | [117] | |||
c-GA/MF/PEG | 1.32 | 4.6 wt% | [118] | |||
Graphene/PA6 | 0.69 | 0.25 wt% | [119] | |||
GA/Epoxy | 2.69 | 1.11 vol% | [120] | |||
GNPs/RGO/Epoxy | 1.56 | 21.4 wt% | [9] | |||
GF/Epoxy | 8.04 | 6.8 wt% | [121] |
SR silicone rubber, PVB polyvinyl butyral, PE polyethylene, BE Bio-based polyester, PC polycarbonate, PA polyamide, MLG multilayer graphene, f-G functionalized grapheme, PCBT poly-cyclic-butylene terephthalate, GHF graphene hybrid foam, DAGF dual assembled graphene framework, VAIGN vertically aligned and interconnected graphene network, GWF graphene woven fabric, MGF multilayer graphene flake, mGNP modified graphene nanoplatelet, c-GA carbonized graphene aerogel