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. 2022 Jun 14;14:127. doi: 10.1007/s40820-022-00868-8

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© The Author(s) 2022

Open AccessThis article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/.

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Fig. 11 — a Schematic illustration of the thermal conduction of thermally conductive films with different anisotropic factors (AF, a ratio of in-plane k to through-plane k), b the modeling of the temperature at t = 360 s when using flexible heat spreader with different k, c the average temperature change of the chip with working time when using flexible heat spreader with different k.

Reproduced with permission from Ref. [128]. Copyright 2019, American Chemical Society. d The thermal infrared images of smartphones under different working conditions when using phenylphosphonic acid@GNPs/PVA film and tinfoil as flexible heater spreader to cool smartphone. Reproduced with permission from Ref. [115]. Copyright 2021, Wiley–VCH