Table 6.

The comparison of characteristics, advantages and disadvantages of four kind of flexible thermally conductive films

Category	Characteristics	Advantages	Disadvantages	In-plane k (W (mK)−1)
Pure polymer films	The alignment of polymer chains through stretching or adjusting the molecules interactions of polymer	No fillers need; electrical insulation; excellent mechanical properties; low density	High cost; complicated fabrication process; low k	0.5–100
All-carbon films	Thermal annealing of GO films at high temperatures and hot compressing; PI graphitization at high temperatures	Promising k; high conductivity	High cost; brittle; no electrical insulation; complicated fabrication process	50–3000
Carbon/polymer composite films	Flexible polymer loaded with carbon-based fillers such as graphite and graphene	Low cost; easy fabrication; high toughness	No electrical insulation; high ITR at the filler/polymer interfaces	5–300
Ceramic/polymer composite films	Flexible polymer loaded with ceramic-based fillers such as BN and Al2O3	Low cost; easy fabrication; electrical insulation; high toughness; good antioxidant performance	Low k; high fillers loading need; high ITR at the filler/polymer interfaces	1–200