Table 1.

Parameters used in microsieve production.

Ablation Parameters	Au and Au + GO	Ni and Ni + GO
Laser impulse energy	100–110 (µJ)	100–110 (µJ)
Number of impulses of the laser beam	25 (-)	25 (-)
Laser beam radiation—first harmonic	1.3 (mJ)
wavelength—first harmonic	1064 (nm)
Laser beam radiation—third harmonic	0.45 (mJ)
wavelength—third harmonic	355 nm
Laser beam radiation—fourth harmonic	0.25 (mJ)
wavelength—fourth harmonic	266 nm
Laser impulse time	70 (ps)
Repetition	1 (kHz)
Microsieve diameter	ϕ23 mm
Microholes diameter	10–12 (µm)
Microholes offset	50 (µm)
No of microholes	~105 (-)