Fig. 2. Fabrication process of the PAMEC device, including (a) Au coating to form the conductive path on the Si3N4 membrane, (b) depositing UO2 PVDF/CB slurry on the detection window in the center of the Si3N4 membrane to form the WE, (c) bonding the reservoir made of PDMS with UO2-attached Si3N4 membrane, and (d) the parts assembly e.g., inserting Teflon tubing. (a) and (b) were imaged by an optical microscope (c) and (d) were taken by a digital camera.
