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. 2022 Jan 21;15(4):e202101888. doi: 10.1002/cssc.202101888

Table 2.

Conditions that led to the highest efficiency for each solvent, and corresponding device data.[a]

Solvent system

D/A

T [°C]

Blade speed [mm s−1]

V oc [V]

J sc [mA cm−2]

FF [%]

PCE [%]

Number of devices per solvent system

Notes

CPME

1 : 0.9

60, 80, 105

90

0.77

−1.25

37.1

0.36

72

thickness, T

CPME/O‐XY (0.65 : 0.35)

0.75 : 1

80

83

0.69

−4.20

33.6

0.97

48

thickness

CPME/O‐XY (1 : 1)

1 : 0.5

80

90

0.77

−4.24

48.4

1.57

120

thickness, D/A ratio

O‐XY

1 : 0.9

80

90

0.75

−7.61

35.8

3.17

144

thickness, D/A ratio

O‐XY

1 : 0.9

80

61

0.91

−10.76

53.0

5.20

24

thickness, 2 layers[b]

CB

1 : 0.5

80

25

0.44

−2.33

28.5

0.30

24

thickness

DCB

1 : 0.75

105

61

0.94

−12.41

51.8

6.02

96

thickness, D/A ratio

CB/DCB (1 : 1)

1 : 1

105

83

0.94

−13.09

52.1

6.43

24

thickness

DCB/O‐XY (1 : 1)

0.5 : 1

105

32

0.88

−8.26

49.3

3.59

48

thickness, D/A ratio

CB/O‐XY (1 : 1)

1 : 0.75

80

10

0.38

−0.67

30.7

0.08

24

thickness

DCB/CPME (1 : 1)

1 : 0.75

105

54

0.57

−20.02

35.7

4.04

24

thickness

[a] V oc: open‐circuit voltage; J sc: short‐circuit current density; FF: fill factor. Notes indicates the screened fabrication parameters [b] The active layer was deposited twice in a sequential deposition, keeping the thickness gradient in both layers.