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. 2022 Jul 19;22(14):5368. doi: 10.3390/s22145368

Figure 4.

Figure 4

Illustration of the MEMS vibrometer microfabrication: (a) HF cavity etching into borofloat wafer; (b) through-glass vias by fs-laser ablation; (c) local boron-doping of the SOI device layer; (d) anodic bonding of SOI and borofloat wafers; (e) metallization by Cr+Au magnetron sputtering and successive Cu electroplating; (f) removing handle layer by KOH etching; (g) fs-laser cutting cantilever into membrane; (h) encapsulation by anodically bonding a glass lid.