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. 2022 Jul 17;13(7):1131. doi: 10.3390/mi13071131

Figure 9.

Figure 9

(a) Multiplex parrel microfluidic device bonded by a microwave-assisted solvent bonding process (chip size: 3 × 5 cm). (b) The bonding strength with different microwave irradiation times from 70 to 250 s. The error bars in the figure were obtained from more than 3 individual experiments. (c) Large (10 × 10 cm) PMMA substrate bonding with ethanol (left) and acetone (right). Both ethanol and acetone concentrations were 50%, and microwave irradiation time was 130 s.