Table 2.
Comparison of TC of the AlN–BN/EP composite obtained in the present study with those reported in the literature.
| Fillers | Polymers | Filler Loading | TC (W/(m K)) |
Application | References |
|---|---|---|---|---|---|
| HoBN a | PC b | 18.5 vol% | 3.09 | Thermal management materials | [18] |
| APTES-BNNS c | Epoxy | 40 wt% | 5.86 | Electronic packaging materials | [29] |
| AlN d | Epoxy | 20 vol% | 2.26 | Thermal management materials | [40] |
| AlN/BN | PA6 e | 50 vol% | 1.04 | Automobile industry | [53] |
| BN | Epoxy | 50 wt% | 6.09 | Thermal management materials | [71] |
| AlN/BN | Epoxy | 50 wt% | 1.38 | Thermal interface materials | [72] |
| BA-NH2 f | CNF g | 50 wt% | 5.93 | Thermal interface materials | [73] |
| AlN/hBN h | PTFE i | 30 vol% | 1.04 | Electronic packaging materials | [74] |
| AlN/BN | UHMWPE j | 50 wt% | 7.1 | Thermal management materials | [75] |
| AlN/BN | Epoxy | 75 wt% | 10.18 | Electronic packaging materials | Current study |
a Horizontally oriented boron nitride plates. b Polycarbonate. c Boron nitride nanosheets functionalized with (3-aminopropyl) triethoxysilane. d Nanoflower-like AlN. e Polyamide 6. f Amine-group-treated hybrid filler comprising boron nitride and aluminum nitride. g Cellulose nanofiber. h Spherical-like aluminum nitride particles and hexagonal boron nitride platelets. i Polytetrafluoroethylene. j Ultrahigh-molecular-weight polyethylene.