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. 2022 Jul 21;15(14):5086. doi: 10.3390/ma15145086

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© 2022 by the authors.

Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).

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(a) A line-type solder joint with high $α$ -angle grains after EM and its EBSD orientation map. The arrow of e^- points in the flow direction of electron. (b) An EBSD orientation map of (c) a line-type solder joint after EM for 400 h. (d) The IMC dissolution in the origin frame of (c) (the arrow of e^- and the arrow of J_Ni point in the flow direction of electron and the Ni flux, respectively). Reprinted with permission from ref. [69]. Copyright 2014 Elsevier.