Table 5. Data of CCL Based on VT-OPE and OPE-2St.
| OPE for CCL | floating (s)a | peeling (lb/in)b P | dipping (s)c | TMA288 °C (min)d |
|---|---|---|---|---|
| VT-OPE | >600 | 5.5 | >600 | >60 |
| OPE-2St | >600 | 4.7 | >600 | >60 |
a
Time for the laminate to delaminate at solder floating test at 288 °C.
b P
eeling strength with copper foil (lb/in).
c
Time for the laminate to delaminate at solder dipping test at 288 °C after the laminate experience pressure cook test at 120 °C for 2 h.
d
Time for an abrupt dimensional change for the laminate in a TMA measurement at 288 °C, that is, the time for delamination of the laminate during the test.