TABLE III.

Comparision with Previous Work

References	Tdis work	[47]	[61] [62] [63]	[10] [64]	[21]	[31]
Type	ASIC external wired	MCU external wired	ASIC external wireless	ASIC implanted wireless	ASIC implanted wireless	ASIC implanted wired
Amplifier Bandwidth	300–1000 Hz	300–1000 Hz	100–7800 Hz	500–5000 Hz	N/A	300–7000 Hz
Number of Channels	93	96	97	100	128	15
Sampling Frequency	2 kSps	2 kSps	20 kSps	20 kSps	20 kSps	25 kSps
Feature Extraction	SBP(CAR)	SBP	N/A	N/A	Spike firing rate*	Spike firing rate*
Decoding	SSKF continuous	N/A	N/A	N/A	Extreme Learning Machine (ELM) discrete (13 classes)	Spiking neural network discrete (63 classes)
Subject model	NHP	NHP	Human & NHP	NHP	NHP (No in-vivo)	Rodent (No in-vivo)
Data-Rate Reduction	4,800× (1D) 2,325× (2D)	100×	1× (recording only)	1× (recording only)	1000×	768×
Data Format	16b fixed-point	32b floating point	12b fixed-point	12b fixed-point	7b fixed-point	8b fixed-point
Process	180 nm	-	500,180 nm	600 nm	350 nm	180 nm
Power	0.581 mW (1D) / 0.588 mW (2D) RHD2132s: 12 mW	33.6 mW	51 mW	90.6 mW	Mixed-signal computing array: 0.4 μW**	Mixed-signal computing array: 4 mW**

^*Off-chip feature extraction used.

^**Power of MCU, AFE, TX/RX not included.