Figure 2.

Structure and mechanical property characterization of flexible electronics. (a) 2D model of main building of Harbin Institute of Technology (HIT). (b) Stretching of 2D channel. (c) 3D model of HIT main building. (d) Scanning electron microscope (SEM) image of hollow tube cross-section. (e) Stretching of 3D spiral channel. (f) Model of tensile tests with different circuit diameters. (g) Individual tensile tests of flexible electronics with different circuit diameters. (h) Statistically averaged tensile tests of flexible electronics with different circuit diameters.