Fig. 13. (a) Illustration of the proposed electrochemical deposition processes of Li metal on the planar current collector and 3D current collector; SEM images of 3D Cu foil (b) and 3D Cu foil with 2 mA h cm⁻² of Li loading (c); (d) voltage profiles of Li metal plating/stripping at 0.2 mA h cm⁻² on different current collectors; (e) illustration of the versatility of the 3D GCF structure; SEM images of 3D GCF (f) and 3D GCF with 8 mA h cm⁻² of Li loading (g); (h) galvanostatic plating/stripping profiles on different current collectors. (a–d) Reproduced with permission.¹⁰⁷ Copyright 2015, Nature Publishing Group; (e and f) Reproduced with permission.¹⁰⁸ Copyright 2017, Wiley-VCH.