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. 2022 Oct 5;8(40):eabj4853. doi: 10.1126/sciadv.abj4853

Fig. 4. Functionalization of the 3D printed array.

Fig. 4.

(A and B) A schematic and a picture of the solder deposition process to attach standard connectors to the 3D printed probe. (C) A picture of soldered joint after reflow. (D and E) A schematic and SEM of the removal of overspray using PFIB etching. The black color represents regions where the substrate is visible, i.e., the overspray has been removed or was never present. (F) Exposure of the tip using PFIB after parylene-C coating, thus enabling the probe to record neural voltages, through the exposed tip area only. (G and H) SEM before and after selective deposition of PEDOT:PSS at the tip using electroplating for reduced impedance.