Ag	Silver
ANOVA	Analysis of variance
ATC	Accelerated temperature cycling
BGA	Ball grid array
Bi	Bismuth
CABGA	Chip array ball grid array
Co	Cobalt
Cu	Copper
DOE	Design of experiment
ENIG	Electroless nickel-immersion silver
ImAg	Immersion silver
Fe	Iron
I/O	Input/output
IMC	Intermetallic compound
In	indium
Ni	Nickel
NSMD	Non-solder mask defined
OSP	Organic solderability preservative
Pb	Lead
PCB	Printed circuit board
RBS	Backscattering spectroscopy
SAC	SnAgCu
Sb	Antimony
SEM	Scanning electron microscopy
SF	Surface finish
SMOBC	Solder mask over bare copper
SMT	Surface mount technology
Sn	Tin
UAH	University of Alabama in Huntsville
β	Shape parameter in Weibull distribution
θ	Scale parameter in Weibull distribution