. 2022 Oct 6;17:100447. doi: 10.1016/j.mtbio.2022.100447

Table 1.

Techniques used to fabricate antibacterial Ti–Cu coating and their antibacterial efficacy.

Substrate	Antibacterial Agents	Fabricating Method	Description	Antibacterial Rate (%)	Ref.
Pure Titanium	Copper	Ion Implantation	The concentration of Cu was 4 × 10¹⁷ Cu ions/cm²	100% in plate count method test	[135]
Si wafer	Ti-xCu film	High power impulse magnetron sputtering (HiPIMS) and DC magnetron sputtering (DCMS)	A cuboid Ti target was used for DC magnetron sputtering (DCMS), and a Cu target was sputtered using high power pulsed magnetron sputtering (HPPMS)	The antibacterial activity of Ti-xCuO coatings, x = 3.1–33.9 at.% in plate count method was 99%	[116]
Pure Ti	Nitrogen (N) and copper (Cu) dual ions	plasma immersion ion implantation and deposition (PIII&D)	Titanium nitride (TiN) film was embedded with Cu nanoparticles (Cu NPs)	Cu–Ti and N/Cu–Ti samples showed nearly 100% antibacterial efficacy in bacterial counting method	[126]
316L stainless steel and Si	Ti-xCu coating	Hybrid high power impulse magnetron sputtering (HiPIMS) and DC magnetron co-sputtering (DCMS)	Ti-xCu coatings were co-sputtered on silicon wafers and polished 316 L stainless steel substrates using DCMS and HiPIMS techniques	Pure Cu and Ti-xCu coatings with x = 55 and 65 at.% showed an antibacterial efficacy of 99.9%	[105]