Table 4.
The effect of processing methods and the microstructure of Ti–Cu alloys on their antibacterial efficacy.
| Alloy (Ti- wt.% of Cu) | Processing Method | Microstructure | R % (antibacterial efficacy) | Mentioned Mechanism | Ref. |
|---|---|---|---|---|---|
| Ti–1Cu | Ingot melting and heat treatment of 900 °C for 18 h followed by 798 °C for 24 h and finally water quench | Solid solution of Cu in Ti | 4% after 6 h of contact with the alloy | Cu ion releasing | [171] |
| Ti-2.5Cu | Solid solution of Cu in Ti, Cu-rich phase | 13% after 6 h of contact with the alloy | |||
| Ti–3Cu | Solid solution of Cu in Ti, Ti2Cu | 16% after 6 h of contact with the alloy | |||
| Ti–10Cu | Solid solution of Cu in Ti, Ti2Cu | 24% after 6 h of contact with the alloy | |||
| Ti–3Cu | Ti–3Cu wrought bar and solid solution treated (900 °C for 5 h + 400 °C for 16 h) | Solid solution of Cu in Ti, and nano-scale of Ti2Cu | ≥99% | Disrupting the proton motive force and resisting the production of ATP by the nano-scale galvanic cells on the surface of Ti–Cu alloy | [177] |
| Ti–2Cu | Powder metallurgy | Solid solution of Cu in Ti, Ti2Cu | ≤79% | Cu ion releasing | [208] |
| Ti–5Cu | Solid solution of Cu in Ti, Ti2Cu, Cu-rich phase | ≤99.2% | |||
| Ti–10Cu | Solid solution of Cu in Ti, Ti2Cu, Cu-rich phase | 99.99% | |||
| Ti–25Cu | Solid solution of Cu in Ti, Ti2Cu, Cu-rich phase | 99.99% | |||
| Ti–5Cu (S) | Powder metallurgy | α-Ti phase and a small amount of Ti2Cu phases | 99.3% | Cu ion releasing and contact with the Ti2Cu phase | [257] |
| Ti–5Cu(E) | Extrusion process (sintered alloys were extruded at 800 °C at a rate of 10 mm/s) | α-Ti phase and a small amount of Ti2Cu phases, phases are smaller and more homogenized | 99.4% | ||
| Ti–10Cu(S) | Powder metallurgy | α-Ti phase and more Ti2Cu phases | 99.9% | ||
| Ti–10Cu(E) | Extrusion process (sintered alloys were extruded at 800 °C at a rate of 10 mm/s) | α-Ti phase and more Ti2Cu phases with flake shapes, phases are smaller and more homogenized | 99.8% | ||
| Ti–5Cu | Ingot melting followed by heat treatment at 850 °C for 2 h and cooling in the furnace | α -Ti (HCP) matrix and Ti2Cu precipitation | ≥99% | Contacting sterilization of Ti2Cu and Cu ion releasing | [207] |
| Ti–5Cu | Ingot melting followed by heat treatment at 900 °C for 2 h, and air cooling | Ti2Cu phase in the α -Ti matrix | ≤96%, | Cu ion releasing | [178] |
| Ti–5Cu (I) | Alloys were melted and casted in ingot (casting) | Nano-scale Ti2Cu, a relatively high amount of Cu in a solid solution state | 51% | Contact sterilization and Cu ion releasing | [190] |
| Ti–10Cu (I) | More nano-scale Ti2Cu, relatively high amount of Cu in solid solution state | 64% | |||
| Ti–5Cu (T4) | As-cast alloys were heat-treated at 900 °C for 2 h (T4) and quenched in room temperature water | Complete solid solution | <55%a | ||
| Ti–10Cu (T4) | A large amount of solid solution and a small amount of Ti2Cu phase | <70%a | |||
| Ti–5Cu (T6) | As-cast alloys were heat-treated at 900 °C for 2 h and quenched in water, and then at 400 °C for 12 h (T6) | Nano-scale Ti2Cu, a small amount of solid solution | >90%a | ||
| Ti–10Cu (T6) | Nano-scale Ti2Cu phase, a small amount of solid solution | <95%a | |||
| Ti–5Cu (S) | Ti and Cu powders were sintered (sintering) | Micro-scale Ti2Cu, a minimal amount of solid solution | >99%a | ||
| Ti–10Cu (S) | More micro-scale Ti2Cu, very small amount of solid solution | >99%a |
a
Data were derived from the graphs presented in the referenced paper.