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. 2022 Oct 26;11:310. doi: 10.1038/s41377-022-00994-3

Table 4.

Material removal of sub-aperture tool on PVD Si-cladding RB-SiC substrate

Sub-aperture tool CCOS Stressed lap MRF IBF
Typical spot graphic file with name 41377_2022_994_Taba_HTML.gif graphic file with name 41377_2022_994_Tabb_HTML.gif graphic file with name 41377_2022_994_Tabc_HTML.gif graphic file with name 41377_2022_994_Tabd_HTML.gif
Spot size/mm ⌀20 ⌀340 47.7 × 24.4 FWHM 44.5
VRR (mm3/min) 0.105 1.51 0.39 0.71
PRR (μm/min) 0.66 0.02 0.90 0.31
Typical Param. #1 Pad Diam. Pad Diam. Wheel Diam. Grid Diam.
Value 15 mm 300 mm 400 mm 50 mm
Typical Param. #2 Spindle RPM Spindle RPM Wheel RPM Grid Voltage
Value 300 50 60 1003