Skip to main content
. 2022 Oct 30;9:101898. doi: 10.1016/j.mex.2022.101898

Table 2.

Process details in process A1-spin, for 60% SU-8.

Step Equipment Details Comments
Photolithography to define via on 60% SU-8
Spin-coat 60% SU-8 6000.5 Spin-coater
  • 1.

    500 RPM, 5 s, 500 RPM/s

  • 2.

    6000 RPM, 36 s, 1000 RPM/s

  • 3.

    0 RPM, 6s, 1000 RPM/s

 SU-8 thickness 223 nm
Soft bake Hot plate 100°C, 60 s Hotplate surface temperature
Photolithography Contact aligner/ stepper, photomask 329 mJ/cm2, 365 nm (i-line) UV
(Changes with SU-8 composition/thickness)		 Use index matching fluid to improve contact between SU-8 and mask and create hard-contact in the case of contact aligner.
Post-exposure bake Hot plate 100°C, 120 s Hotplate surface temperature
Develop in SU-8 developer Wet bench 30 s Vigorous swish. Wash developer in IPA, blow dry IPA in N2
Hard bake Hot plate 100°C, 30 mins Hotplate surface temperature