Table 2.
Summary of the XPS Analysis of surface composition of different sensor chips before and after cleaning procedures.
| LTCC | Gold Au 4f |
Carbon C 1s |
Oxygen O 1s |
Iodine I 3d5/2 |
Silver Ag 3d5/2 |
Other elements |
|---|---|---|---|---|---|---|
| Uncleaned | 21.7 ± 5.3 | 61.7 ± 5.4 | 15.7 ± 0.1 | 0.4 ± 0.1 | 0.6 ± 0.2 | - |
| UV-O3 | 60.4 ± 3.9 | 21.4 ± 1.5 | 15.7 ± 1.7 | 0.4 ± 0.2 | 2.2 ± 0.6 | - |
| Piranha | 70.1 ± 0.3 | 23.1 ± 1.1 | 6.3 ± 1.2 | 0.2 ± 0.1 | 0.5 ± 0.1 | - |
| KOH + H2O2 | 64.4 ± 3.0 | 23.4 ± 1.3 | 8.6 ± 0.2 | 0.5 ± 0.3 | 3.2 ± 1.2 | - |
| KOH + H2O2/KOH sweep | 62.1 ± 4.0 | 20.2 ± 1.3 | 16.5 ± 7.3 | - | 1.3 ± 0.0 | - |
| H2SO4 CV | 70.1 ± 1.2 | 22.5 ± 1.7 | 5.9 | - | 1.6 ± 0.0 | - |
| PEN | Gold Au 4f |
Carbon C 1s |
Oxygen O 1s |
Iodide I 3d5/2 |
Silver Ag 3d5/2 |
Fluorine F 1s |
|---|---|---|---|---|---|---|
| Uncleaned | 46.2 ± 5.9 | 34.5 ± 5.5 | 12.7 ± 1.6 | 4.9 ± 1.4 | 0.2 ± 0.0 | 1.7 ± 0.3 |
| UV-O3 | 49.3 ± 1.0 | 31.1 ± 0.5 | 19.6 ± 0.6 | - | 0.1 ± 0.1 | - |
| Piranha | 54.8 ± 3.0 | 29.6 ± 1.4 | 11.4 ± 1.7 | 3.8 ± 2.3 | - | 0.5 ± 0.5 |
| KOH + H2O2 | 62.4 ± 0.7 | 28.8 ± 0.5 | 8.6 ± 0.1 | - | 0.3 ± 0.1 | - |
| KOH + H2O2/KOH Sweep | 66.7 ± 1.4 | 25.7 ± 0.9 | 7.3 ± 0.4 | - | 0.3 ± 0.1 | - |
| H2SO4 CV | 57.9 ± 1.1 | 29.4 ± 0.9 | 12.6 ± 0.2 | - | 0.1 ± 0.1 | - |
| PCB | Gold Au 4f |
Carbon C 1s |
Oxygen O 1s |
Nickel Ni 2p3/2 |
Silicon Si 2s |
Nitrogen N 1s |
|---|---|---|---|---|---|---|
| Uncleaned | 20.9 ± 0.1 | 38.1 ± 2.1 | 26.4 ± 0.5 | 2.3 ± 0.1 | 10.1 ± 2.4 | 2.3 ± 0.5 |
| UV-O3 | 43.3 ± 3.3 | 29.6 ± 2.6 | 19.5 ± 3.6 | 3.0 ± 1.8 | 1.5 ± 1.5 | 1.8 ± 0.6 |
| Piranha | 15.3 ± 4.9 | 33.7 ± 4.5 | 36.3 ± 0.9 | 11.9 ± 0.6 | 1.0 ± 0.9 | - |
| KOH + H2O2 | 49.2 ± 2.4 | 27.8 ± 0.8 | 16.9 ± 0.9 | 3.3 ± 0.8 | 0.8 ± 0.8 | 2.1 ± 0.8 |
| KOH + H2O2/KOH Sweep | 46.2 ± 1.8 | 29.3 ± 0.8 | 20.1 ± 0.3 | 4.6 ± 0.8 | - | 2.1 ± 0.8 |
Elemental concentrations are given in percent. Measurements are averaged over multiple samples.