Table 1.

Materials used in the study

Material	Classification	Composition	Application
Adper Scotchbond Multi-purpose (SBMP; 3 M ESPE, St. Paul, MN, USA)	Three-step total-etch adhesive	Etchant 35% phosphoric acid Primer HEMA, polyalkenoic acid polymer, water Bond HEMA, Bis-GMA, tertiary amines, photoinitiator	Acid etch for 15 s, water rinse for 10 s, gently air dry for 5 s Apply primer for 10 s, gently air dry for 5 s Apply bond. Gently air dry Light cure 10 s
Clearfil SE Bond (SE; Kuraray, Osaka, Japan)	Two-step self-etch adhesive	Primer 10-Methcryloyloxydecyl Dihydrogen phosphate (MDP), HEMA, hydrophilic dimethacrylates, photoinitiator, amine, water Bond MDP, Bis-GMA, HEMA, hydrophobic dimethacrylate, colloidal silica, photoinitiator	Apply primer for 20 s, gently air dry for 5 s Apply bond, Gentle air dry Light cure 10 s
Estelite quick (Tokuyama, Tokyo, Japan)	Nano-filled composite resin	Bis-GMA, TEGDMA, silica zirconia fillers, silica-titania fillers, photoinitiators	Resin composite placement through incremental technique with each 2.0 mm increment light-cured

HEMA (hydroxyethyl)methacrylate, BisGMA bisphenol A glycidylmethacrylate, MDP 10-methacryloyloxydecyl dihydrogen phosphate, TEGDMA triethylene glycol dimethacrylate