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. 2022 Nov 30;16(12):19755–19788. doi: 10.1021/acsnano.2c07723

Table 2. Dissolution Products, Rate, and Factor for Metal-Based Conductive Materials.

metallic conductor dissolution product/solution dissolution rate dissolution factor ref
Zn, Mg, Mg alloy Zn(OH)2, Mg(OH)2 300 nm/day room temperature, 37 °C, ceased within 8 h with MOSFET film (157,159)
Mg PBS solution   dissolution kinetic depends on the temperature and pH (170172)
pH increases from 7.4 to 10, temp decreases from 37 to 25 °C
dissolution over 2 min to 12 h
Mo, W H2MoO4, H2WO4, ∼10–2 nm/day pH and temperature of the surrounding environment (162,168,169)
Zn Zn(OH)2 1.7 nm/day pH and temperature of the surrounding environment (162,168,169)
Zn viofluid solution 7.2 nm/day pH and temperature of the surrounding environment (162,168,169)
Fe Fe(OH)2   pH and temperature of the surrounding environment